Loctite 3609 Epoxy Gel for Pre-Wave Soldering low temperature cure ASSEMBTEK Solution: Strictly control the

ASSEMBTEK Solution: Strictly control the dilution ratio at 30-40% (30-40 parts by weight of tap water per 100 parts by weight of BC-367)

Class H insulation

improve construction efficiency

Medium curing speed

Do not pour unused adhesive back into the original bottle to avoid contamination

Loctite 3609 Epoxy Gel for Pre-Wave Soldering low temperature cure ASSEMBTEK Solution: Strictly control theAdhesive epoxy gel for bonding surface mount components to printed circuit boards prior to wave soldering LOCTITE 3609 is a dark red tacky epoxy gel suitable for bonding surface mount components to printed circuit boards prior to wave soldering. It is particularly suitable for applications requiring medium to high dispensing speeds, high precision dispensing specifications, high wet strength and good electrical properties.