IMPLANT - FIXTURE REGULAR (OSSTEM TSIII), DIAMETER 4.0, HEIGHT VARIES, NON MOUNTED Laboratory Thermal Forming Splint/Copolyester

Thermal Forming Splint/Copolyester

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Lower load forces of engagement

HyFlex EDM NiTi File 30/

The transitions between dentine and LuxaCore Z Dual is imperceptible and allows for groove-free preparations without any undercuts

IMPLANT - FIXTURE REGULAR (OSSTEM TSIII), DIAMETER 4.0, HEIGHT VARIES, NON MOUNTED Laboratory Thermal Forming Splint/CopolyesterTSIII SA SYSTEM INTRODUCTION The TS implant system is the most popular implant system used by implantologists worldwide. Distinct with its excellent design, efficient corkscrew thread, self tapping ability and sustainable primary stability. DESCRIPTION OF THE TSIII IMPLANT: The TSIII implant has been developed by Osstems R&D team to be the ultimate implant for any case with its carefully thought out design and the simplicity in its use. The TSIII