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1ab LLDP RFC 768 UDP RFC 793 TFTP RFC 791 IP RFC 792 ICMP RFC 2068 HTTP RFC 1112 IGMP v1 RFC 2236 IGMP v2 RFC 337 RFC 2710MLD v1 FRC 3810 MLD v2 RFC 2328 OSPF v2 RFC 1058 RIP v1 RFC 2453 RIP v2 Temperature Operating Temperature: 0 ~ 50 degrees C (24 x 10G SFP+ + 2 x QSFP28) Relative humidity: 10 ~ 85% (non-condensing) Storage Temperature: -40 ~ 80 degrees C Relative humidity: 5 ~ 95% (non-condensing)
01 Lux@ (F1
Dimensions 10
Pneumatic control
Fabricada en materiales de alta resistencia
Placa de pared modular MAX, de 4 salidas, color blanco, versión bulk (Sin Empaque Individual) 73247 1ab LLDP RFC 768 UDPMAX modular wall plates combine high capacity with an aesthetic that makes them compatible with current technologies. Wall plates are designed to be used with angled or flat MAX modules. MAX wall plates are compatible with shielded Z MAX connectors (For Z MAX UTP connectors use 10G MAX wall plates.) Installation Flexibility: Mounting tab allows connector installation from the front or back of the board. High Density: Up to 6 outlets can be fitted on a
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